3 IR Reflow
Suggested IR Profile: Devices are built using lead free epoxy and can be subjected to standard lead free IR reflow conditions shown in Table 7. Contact pads are gold over nickel and lower maximum temperatures can also be used, such as 220°C.
| Parameter Symbol | Minimum | Maximum | Conditions |
|---|---|---|---|
| TS(1) | 150°C | 200°C | Pb-free |
| TS(2) | 100°C | 150°C | _SNPB Option |
| tS(1) | 60 sec. | 180 sec. | Pb-free |
| tS(2) | 60 sec. | 120 sec. | _SNPB Option |
| tl(1) | 60 sec. | 150 sec. | Pb-free |
| tl(2) | 60 sec. | 150 sec. | _SNPB Option |
| tp(1) | 245°C | 260°C | Pb-free |
| tp(2) | 225°C | 240°C | _SNPB Option |