11.2.2 375-Ball TFBGA Mechanical Characteristics

Table 11-88. 375-Ball TFBGA Package Characteristics
Moisture Sensitivity Level3
Table 11-89. Device and 375-Ball TFBGA Package Weight
190mg
Table 11-90. Package Reference
JEDEC Drawing ReferenceN/A
J-STD-609 Classificatione8
Table 11-91. 375-Ball TFBGA Package Information
Ball Land0.35 mm
Nominal Ball Diameter0.25 mm
Solder Mask Opening0.25 mm
Solder Mask DefinitionSMD
SolderLF35