E | 06/2021 | Document | Replaced Master/Slave with the new terminologies. For more details, see the
following note. |
Europe | Updated European Compliance table. |
Ordering Information and Module Marking | Updated Figure 1-1 with Tray and Tape and Reel packing information. |
D | 10/2020 | ATWINC15x0-MR210PB Placement and Routing
Guidelines | Updated |
Nonvolatile Memory (eFuse) | Updated the contents. |
Interfacing with the Host
Microcontroller | Updated |
Application Schematic | Updated Figure 9-1 |
ATWINC15x0-MR210UB Placement and Routing
Guidelines | Updated |
Reference Documentation | Updated Table 13-1 |
Block Diagram | Updated Figure 2-1 |
Pin Description | Updated Figure 2-2 |
WLAN Subsystem | Added footnotes for Short GI feature |
Transmitter Performance |
|
External Interfaces |
|
GPIO Pins | Added Notes |
Current Consumption in Various Device States | Updated Table 7-1 |
Recommended External Antenna for
ATWINC15x0-MR210UB | Added |
Regulatory Approval |
- Added Gain Table for Individual
Regulatory Region section
- Updated United States, Canada and Europe with the
details of antennas used for approval
- Revamped Europe section
- Added expiry date information
in China
- Added regulatory note for
Brazil (ANATEL) in Brazil
|
Reference Documentation | Updated Table 13-1 |
C | 09/2018 | Features | Added Enterprise security feature and related note. |
Ordering Information and Module Marking | Updated Table 1-1. |
Pin Description | Updated Table 2-1. |
SPI Timing | Added note for Table 6-3. |
Schematic Design Information | Editorial updates. |
Module Assembly Considerations | Editorial updates. |
Reflow
Profile Information |
- Removed Solder Paste.
- Removed Stencil Design.
- Editorial updates.
|
Regulatory Approvals | Updated the content of certifications to include the details of
ATWINC1510-MR210UB module. |
B | 12/2017 | Introduction | Editorial updates. |
Features | Editorial updates. |
Regulatory Approvals | Revised the content of certifications. |
Reference Documents | Updated Table 15-1. |
A | 02/2017 | Document |
- Change of document style.
- Change the name to incorporate
all the ATWINC15x0-MR210xB module
family.
- New Microchip document number.
Previous version was Atmel document 42502 rev. B.
|
Product Description
|
- Added description information
indicating that the document content is relevant to all WINC1500 Module models
unless noted.
- Changed SSL references to
TLS.
- Removed WAPI security.
- Removed UART as host interface.
- Editorial updates.
|
Product Features |
- Removed WAPI security.
- Removed UART and I2C
as host interfaces.
- Removed Bluetooth coexistance
interface.
- Replaced SSL with TLS.
- Added 26 MHz crystal.
- Removed: (4KB flash – less than
1KB RAM).
|
Order Information and Module Marking |
- Revised Ordering table.
- Revised Marking information.
Figure.
|
| | Block Diagram |
- Revised Block Diagram
figure.
|
Pin Description |
- Revised Pin Description
drawing.
- Editorial updates.
|
Electrical Specifications |
- Revised VDDIO maximum voltage
in table 4.1 and added max temperatures.
- Revised table 4-2 to include
Recommended operating temperature.
|
CPU and Memory Subsystems |
|
WLAN Subsystem RADIO |
- Added text regarding
performance derating at cold temperature.
- Features table revisions and
changes:
- Corrected the package
height
- Revised Storage
temperature
- Added performance test
conditions to the performance tables.
- Revised the Receive performance
in table 6-2.
- Revised the 802.11b mode
Transmit performance numbers in table 6-3.
- Revised Transmit performance
Footnotes.
- Changed max frequency to
2.472GHz.
- Editorial updates.
|
External Interfaces |
- Revised SPI timing information
in table 7-3.
- Removed Bluetooth Coexistance
section.
- Removed SDIO.
- Editorial updates.
|
Power Consumption |
- Added Module Reset section for
reset duration.
- Editorial updates.
|
ATWINC15x0-MR210PB Placement and Routing
Guidelines |
- Added text for antenna types
used in test and an associated table.
- Revised Co-Ax connector
type.
|
Schematic Design Information |
- Removed SDIO schematic.
- Editorial updates.
|
Module Drawings |
- Updated module drawing figures
and figure titles.
- Added section with footprint
drawing.
|
Design Considerations |
- Added sections for Module
design and assembly considerations and module PCB placement.
|
Reflow
Profile Information |
- Revised reflow profile picture
to be clearer.
- Editorial updates.
|
Certification Notices |
- Added section for Agency
Certification notices (now under Regulatory Approvals with Rev. B).
|
Agency Regulatory Approvals |
- Added back Agency Approval
section.
- Revised content of
certifications.
|
Reference Documents |
- Moved Design File Package to a
separate paragraph below the table to remove web availability aspect and to
contact sales.
|