1.1 Package Drawings

The package drawings were updated and converted from the former Atmel format to the Microchip format. The following table shows the updated dimensions of the package drawings.

Table 1-1. Updated Dimensions of Package Drawings
		Old Dimensions			New Dimensions
Dimension	Symbol	Min.	Nom.	Max.	Min.	Nom.	Max.	Units
Overall Height	A	0.80	0.85	0.90	0.80	0.90	1.00	mm

Note: For the most current package drawings, refer to http://www.microchip.com/packaging.

Figure 1-1. 32-Lead Very Thin Plastic Quad Flat, No Lead Package (RTB) – 5 x 5 mm Body [VQFN] With 3.6 x 3.6 mm Exposed Pad and Stepped Wettable Flanks; Atmel Legacy ZBS

Figure 1-2. 32-Lead Very Thin Plastic Quad Flat, No Lead Package (RTB) – 5 x 5 mm Body [VQFN] With 3.6 x 3.6 mm Exposed Pad and Stepped Wettable Flanks; Atmel Legacy ZBS

Figure 1-3. 32-Lead Very Thin Plastic Quad Flat, No Lead Package (RTB) – 5 x 5 mm Body [VQFN] With 3.6 x 3.6 mm Exposed Pad and Stepped Wettable Flanks; Atmel Legacy ZBS

The online versions of the documents are provided as a courtesy. Verify all content and data in the device’s PDF documentation found on the device product page.