1.1.1 2-Lead VSFN and XSFN Contact Packages

The 2-Lead VSFN and XSFN contact packages are unique solutions designed for disposable and accessory applications, where cartridges or accessories are frequently replaced. Unlike traditional integrated circuit packages, which require soldering onto a printed circuit board (PCB) that typically contains multiple ICs and passive components, these contact packages are tailored for scenarios where electronics are added solely for authentication purposes.

In such disposable applications, the requirement is often limited to a single cryptographic IC and a decoupling capacitor. The SHA106 integrates both components within a single package, ensuring that all necessary electronics for the disposable accessory are fully contained.. This design enables alternative connection methods that can eliminate the need for a PCB in the system.

Contact packages offer a distinctive solution by allowing the device to be attached to the accessory using adhesive, with the package’s pads exposed for future connection to the host system. Commonly, a 2-pin contactor or pogo pin connection is used to connect the accessory with the host device. This approach provides a simple and reliable connection, while reducing the cost of implementing authentication in disposable accessories.