39.3.6 Thermal Characteristics

Table 39-6.
Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +125°C
Param No.	Sym.	Characteristic	Typ.	Units	Conditions
TH01	θ_JA	Thermal Resistance Junction to Ambient	70.0	°C/W	14-pin PDIP package
			95.3	°C/W	14-pin SOIC package
			100.0	°C/W	14-pin TSSOP package
			51.5	°C/W	16-pin UQFN 4x4mm package
			62.2	°C/W	20-pin PDIP package
			87.3	°C/W	20-pin SSOP package
			77.7	°C/W	20-pin SOIC package
			43.0	°C/W	20-pin UQFN 4x4mm package
TH02	θ_JC	Thermal Resistance Junction to Case	32.75	°C/W	14-pin PDIP package
			31.0	°C/W	14-pin SOIC package
			24.4	°C/W	14-pin TSSOP package
			5.4	°C/W	16-pin UQFN 4x4mm package
			27.5	°C/W	20-pin PDIP package
			31.1	°C/W	20-pin SSOP package
			23.1	°C/W	20-pin SOIC package
			5.3	°C/W	20-pin UQFN 4x4mm package
TH03	T_JMAX	Maximum Junction Temperature	150	°C
TH04	PD	Power Dissipation	—	W	PD=P_INTERNAL+P_I/O
TH05	P_INTERNAL	Internal Power Dissipation	—	W	P_INTERNAL=I_DDxV_DD⁽¹⁾
TH06	P_I/O	I/O Power Dissipation	—	W	P_I/O=Σ(I_OLV_OL)+Σ(I_OH(V_DD-V_OH))
TH07	P_DER	Derated Power	—	W	P_DER=PD_MAX (T_J-T_A)/θ_JA⁽²⁾
Note: I_DD is current to run the chip alone without driving any load on the output pins. T_A = Ambient Temperature, T_J = Junction Temperature.

PIC16(L)F18424/44