Introduction
1 Secure Boot and Signature Header Generation
2 Getting Started with WBZ351 Curiosity Board
This section covers evaluation board features and running the preprogrammed demo example
3 Getting Started with Software Development
This section gives a detailed information on the steps to install IDE, compiler, tool chain, BLE, Zigbee stacks and application examples on the PC.
4 Bluetooth Low Energy Applications
This section provides details on documentation describing the steps to test and develop the precompiled BLE application examples.
5 PIC32CXBZ3/WBZ35 Three-Wire PTA Coexistence Design
6 Getting Started with Zigbee Applications
7 Flashing hex from MPLAB DISCOVER using MPLAB IPE
This section provides a detailed procedure of how to download an already existing application hex file from MPLAB DISCOVER and flash the hex file into WBZ351 Curiosity Board using MPLAB IPE.
8 Adding Chip Peripherals
This section describes how to add analog/digital peripherals to the application
9 Low Power Design
This section explains in detail on how to enable the low power modes – Sleep/Standby or Deep Sleep/Backup modes in the design.
10 Firmware and OTA Updates
This section documents how to enable firmware updates in the design, whether it is serial or Over The Air (OTA)
11 Wireless System and Board Support Services
12 Application Timer Service
13 Support Documentation
This section has documentation that is generic and used as supporting document with the application example documentation.
14 Software API Guide
- 14.1 BLE Software
  - 14.1.1 BLE Document
  - 14.1.2 BLE Document
- 14.2 Zigbee SW
  Enter a short description of your topic here (optional).
- 14.3 PIC32CX-BZ3 Device Support Component Library Help
  The PIC32CX-BZ3 Device Support Component Library provides software API's for various subsystems in the PIC32CX-BZ3.
- 14.4 PIC32CX-BZ3 Persistent Data Server Component Library Help
  The PIC32CX-BZ3 Persistent Data Server Component Library provides interface for storing and restoring items into the Non volatile memory using wear leveling mechanism
Microchip Information

14.1.1.2.5 Connection Establishment Procedures

Connection establishment requirements may be defined by the higher layer specification.