4.1 Packaging and Footprint Comparison Between WBZ451 and WBZ451H Modules
This chapter provides details about the package dimensions and the differences in footprints between the WBZ451 and the WBZ451H modules.
Note: While the WBZ451H module is longer than the WBZ451 module, the Land Grid Array (LGA) pads are positioned identically. As a result, the user can solder the WBZ451H module onto the existing WBZ451 module footprint.
Figure 4-1. WBZ451 and WBZ451H PCB ModulesFigure 4-2. Package Drawing Comparison Between WBZ451 and WBZ451H Modules
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