Introduction
1 Getting Started with WBZ451 Curiosity Board
This section covers the evaluation board features and running the preprogrammed demo example.
2 Getting Started with Software Development
This section gives a detailed information on the steps to install IDE, compiler, tool chain, BLE, Zigbee stacks and application examples on the PC.
3 Getting Started with Bluetooth Low Energy Applications
This section provides details on documentation describing the steps to test and develop the precompiled BLE application examples.
4 Getting Started with Zigbee Applications
5 Getting Started with Multiprotocol Applications
This section describes steps to test and develop the precompiled BLE and Zigbee coexistence application examples.
6 Getting Started with IEEE 802.15.4 P2P Phy Application
7 Getting Started with IEEE 802.15.4 MAC Applications
8 Getting Started with Thread Applications
9 Adding Chip Peripherals
This section describes how to add analog/digital peripherals to the application
10 Flashing hex from MPLAB DISCOVER using MPLAB IPE
This section provides a detailed procedure of how to download an already existing application hex file from MPLAB DISCOVER and flash the hex file into WBZ451 Curiosity Board using MPLAB IPE.
11 Low Power Design
This section explains in detail on how to enable the low power modes – Sleep/Standby or Deep Sleep/Backup modes in the design.
12 Firmware and OTA Updates
This section documents how to enable firmware updates in the design, whether it is serial or Over The Air (OTA)
13 Wireless System Services API
14 Support Documentation
This section has documentation that is generic and used as supporting document with the application example documentation.
15 Software API Guide
16 Porting Guide
Microchip Information

16.3.1 Packaging and Footprint Comparison Between WBZ451 and WBZ451H Modules

This chapter provides details about the package dimensions and the differences in footprints between the WBZ451 and the WBZ451H modules.

Note: While the WBZ451H module is longer than the WBZ451 module, the Land Grid Array (LGA) pads are positioned identically. As a result, the user can solder the WBZ451H module onto the existing WBZ451 module footprint.

Figure 16-3. WBZ451 and WBZ451H PCB Modules

Figure 16-4. Package Drawing Comparison Between WBZ451 and WBZ451H Modules