3.5.4 Programming Time

A clarification of the Programming Time section has been made. Table 36-34 has been upgraded from Programming Times to Memory Programming Specifications in the Electrical Characteristics. Functional change is shown in bold.

Table 36-34. Memory Programming Specifications

SymbolDescriptionMin.Typ.✝Max.UnitConditions
Data EEPROM Memory Specifications
EEE*Data EEPROM byte endurance100kErase/Write cycles-40°C ≤ TA ≤ +105°C
tEE_RETCharacteristic retention40Year TA = 55°C
tEE_PBCPage Buffer Clear (PBC)7 CLKCPU cycles
tEE_EEERFull EEPROM Erase (EEER)4ms
tEE_WPPage Write (WP)2ms
tEE_ERPage Erase (ER)2ms
tEE_ERWPPage Erase-Write (ERWP)4ms
Program Flash Memory Specifications
EFL*Flash memory cell endurance10kErase/Write cycles-40°C ≤ TA ≤ +105°C
tFL_RETCharacteristic retention40Year TA = 55°C
VFL_UPDIVDD for Chip Erase operationVBODLEVEL0(1)VDDMAXV
tFL_PBCPage Buffer Clear (PBC)7 CLKCPU cycles
tFL_CHERChip Erase (CHER)4ms
tFL_WPPage Write (WP)2ms
tFL_ERPage Erase (ER)2ms
tFL_ERWPPage Erase/Write (ERWP)4ms
tFL_UPDIChip Erase with UPDI 50ms4 KB Flash
30ms2 KB Flash

Data found in the “Typ.” column is at TA = 25°C and VDD = 3.0V unless otherwise specified. These parameters are not tested and are for design guidance only.

* These parameters are characterized but not tested in production.

Note:
  1. During Chip Erase, the Brown-out Detector (BOD) configured with BODLEVEL0 is forced ON. The erase attempt will fail if the supply voltage VDD is below VBOD for BODLEVEL0.