3.2.3 Programming Time

A clarification of the Programming Time section is made. Table 33-34 has been upgraded from Programming Times to Memory Programming Specifications in the Electrical Characteristics. Functional changes are shown in bold.

Table 33-34. Memory Programming Specifications

Symbol Description Min. Typ.✝ Max. Unit Conditions
Data EEPROM Memory Specifications
EEE* Data EEPROM byte endurance 100k Erase/Write cycles -40°C ≤ TA ≤ +105°C
tEE_RET Characteristic retention 40 Year TA = 55°C
tEE_PBC Page Buffer Clear (PBC) 7 CLKCPU cycles
tEE_EEER Full EEPROM Erase (EEER) 4 ms
tEE_WP Page Write (WP) 2 ms
tEE_ER Page Erase (ER) 2 ms
tEE_ERWP Page Erase-Write (ERWP) 4 ms
Program Flash Memory Specifications
EFL* Flash memory cell endurance 10k Erase/Write cycles -40°C ≤ TA ≤ +105°C
tFL_RET Characteristic retention 40 Year TA = 55°C
VFL_UPDI VDD for Chip Erase operation VBODLEVEL0(1) VDDMAX V
tFL_PBC Page Buffer Clear (PBC) 7 CLKCPU cycles
tFL_CHER Chip Erase (CHER) 4 ms
tFL_WP Page Write (WP) 2 ms
tFL_ER Page Erase (ER) 2 ms
tFL_ERWP Page Erase/Write (ERWP) 4 ms
tFL_UPDI Chip Erase with UPDI 40 ms 32 KB Flash

Data in the “Typ.” column is at TA = 25°C and VDD = 3.0V unless otherwise specified. These parameters are not tested and are for design guidance only.

* These parameters are characterized but not tested in production.

Note:
  1. The Brown-out Detector (BOD) configured with BODLEVEL0 is forced ON during Chip Erase. The erase attempt will fail if the supply voltage VDD is below VBOD for BODLEVEL0.