WLR089U0

10.2 Module Outline Drawings

This section provides the package dimension details of the WLR089U0 module.

Note: For the most recent package drawings, see the Microchip Packaging Specification located at http://www.microchip.com/packaging.

Figure 10-2. WLR089U0 Module Package Outline Drawings

The module pins are arranged with a 1 mm pitch distance. The module is designed symmetrically.

Figure 10-3. WLR089U0 Module Package Outline Drawings – Contd.,

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