47 Document Revision History
Section | Description |
---|---|
Document |
|
Introduction | Updated section with Pulse Width Modulation (PWM) Outputs information |
Package and Operating Conditions | Added -40°C to +125°C temperature range related to the WBZ451PE-E Module |
Certifications | Added certification information related to the WBZ451PE-E Module |
PIC32CX-BZ2 SoC Ordering Information |
|
WBZ45 Module Ordering Information |
|
WBZ45 Module Placement Guidelines | Updated Figure 4-10 and Figure 4-11 |
Pinout Diagram | Updated Figure 3-2 and Figure 3-3 |
Pinout Diagram | Updated Figure 4-3 to Figure 4-5 |
Basic Connection Requirement |
|
Reset Requirements | Updated Figure 4-9 |
Pinout and Signal Descriptions List | Added zeroth pin (pin 0) to Table 5-1 |
Section | Description |
---|---|
Introduction | Updated the trademark symbol |
Operating Conditions | Added WBZ451H operating conditions |
Bluetooth® | Added WBZ451H “Typical Receiver Power Sensitivity” |
802.15.4/Zigbee® Modulation Scheme |
|
System Peripherals | Removed the feature “One Analog Comparator (AC) with Window Compare function” |
Core: 64 MHz ARM® Cortex®-M4 | Updated 3.35 Coremark®/MHz to 2.42 Coremark/MHz |
WBZ45 Module Variants | Added WBZ451H module |
Acronyms and Abbreviations | Added new |
WBZ45 Module Ordering Information | Added WBZ451H ordering information |
Configuration Summary | Added WBZ451H “Configuration Summary” |
WBZ45 Module Description | Added WBZ451H “Module Block Diagram” |
Pinout Diagram | Added WBZ451H “Pinout Diagram” |
Power Pins | Added WBZ451H power pin details |
Reset Requirements | Added new topic for WBZ451H |
WBZ451H Module Interface Specifications | Added new topic for WBZ451H |
Figure 4-11 | Added the figure for WBZ451H |
WBZ45 Module RF Considerations | Added “RF Specifications” for WBZ451H |
Pinout and Signal Descriptions List | Added “Pinout and Signal Descriptions List” for WBZ451H |
INTFLAG | “This flag is set when a new measurement is completed” added as a note |
CTRLC | Added a note regarding LIN specification for bits 8 to 9 and 0 to 2 |
LUTCTRL | Added a note for bit 1: “Prevents/protects write access to the other bits in the LUTCTRL registers” |
Added “The user needs to clear INTFLAG.MCx at the beginning of the interrupt routine and poll the bit until INTFLAG.MCx is cleared, before exiting the ISR” as additional sentence | |
CTRLBCLR | Updated register description for bit 0 |
CTRLBCLR | Updated register description for bit 0 |
Features |
|
Section | Description |
---|---|
Bluetooth® |
|
802.15.4/Zigbee® Modulation Scheme | Changed RX sensitivity 103 dBm to 100 dBm |
System Peripherals | Minor change |
Package | Updated with WBZ450 information |
WBZ45 Module Features | Updated the sentence |
WBZ45 Module Variants | Updated with WBZ450 information |
Package and Operating Conditions | |
Certifications | Added one of the notes |
PIC32CX-BZ2 SoC Ordering Information | Added PIC32CX1012BZ24032 ordering information |
WBZ45 Module Ordering Information | Added WBZ450 ordering information |
Configuration Summary | Updated with WBZ450 information |
Pinout Diagram | Added PIC32CX1012BZ24032 pinout diagram |
Pinout Diagram | Added WBZ450 pinout diagram |
Basic Connection Requirement | Added WBZ450 diagram |
Unused I/O Pins | Removed the note |
PCB Antenna | Added antenna radiation pattern images |
External Antenna Placement Recommendations | Updated the figure |
Pinout and Signal Descriptions List | Updated with WBZ450 information |
CHECON | Minor change |
PBxDIV, REFOxTRIM, REFOxCON, SLEWCON, CLK_DIAG, SPLLCON | Updated the Reset values |
Power Modes | Minor change |
DSCON | Added new topic |
CFGCON0(L) | Minor change |
CFGCON1(L) | Added new bits |
CFGPCLKGEN1 | Minor change |
Features | Added COMP and COMP1 related points |
Features | Typical receiver power sensitivity values updated |
RF Physical Layer | Updated transceiver architecture block diagram |
Transmit Mixer and Power Amplifier | Minor change |
Electrical Characteristics | Updated all the topics for this chapter |
WBZ450 Module Packaging Information | Added WBZ450 packaging information |
Appendix A: Regulatory Approval |
Section | Description |
---|---|
Document | Initial revision |