BLE_SMP_UpdateBondingInfo
C
uint16_t BLE_SMP_UpdateBondingInfo(uint16_t connHandle, uint8_t encryptKeySize, BLE_SMP_PairInfo_T *p_pairInfo);Description
Updates the paired device information to the SMP module.
Note
It is recommended to call this function once after a connection is established if the connection is bonded. The SMP uses bonding information to verify permissions when processing requests.
Parameters
| Parameter | Description |
|---|---|
| [in] connHandle | Connection handle associated with this connection. |
| [in] encryptKeySize | Size of the encryption key. |
| [in] p_pairInfo | Pointer to the pairing information buffer (see BLE_SMP_PairInfo_T). |
Return values
| Return value | Description |
|---|---|
| MBA_RES_SUCCESS | Information updated successfully. |
| MBA_RES_INVALID_PARA | Invalid connection handle. |