1.1 Package Substrate Support

The 3-lead Contact package is intended to be permanently attached to a base substrate (circuit board, frame, system enclosure, etc.) to provide mechanical support for the IC, as pressure is applied to make the electrical contact.

The embossed/recessed IC receptacle shown in Figure 1-2 is an example, not a required configuration, but it illustrates the need for proper mechanical support for the IC to ensure reliable long-term operation under repeated pressure connection cycles.