1 3-Lead Contact Package
The 3-lead Contact package is a relatively unique concept for integrated circuit packages. Typically, package contacts are soldered down to a PCB board. This is not the case for the 3-lead Contact package. For this package, the contacts are left open for connection via a compression or a pogo-pin connector and the backside of the package is glued to an assembly. Detailed information on the package dimension can be found in Appendix A – Package Drawings.
Standard Usage
- Intended for use with removable or disposable accessories, modules or components.
- Electrical contact between the IC and the host system is accomplished with mechanical pressure contacts to allow accessory removal and replacement.
- Used with common compression or pogo-pin connectors with a 2 mm pitch.
Important: The pinout shown
is common for all currently existing CryptoAuthentication devices that are available
in a 3-lead Contact package. It is recommended to always validate the package pinout
via the device data sheet.