2.3 PCB Layout

The dsPIC33AK512MPS506 DP PIM is a four-layer FR4, 1.55 mm, Plated-Through-Hole (PTH) PCB construction. Figure 2-3 through Figure 2-5 illustrate the PCB layers and Figure 2-6 shows the assembly drawings of the dsPIC33AK512MPS506 DP PIM.

Figure 2-3. dsPIC33AK512MPS506 Digital Power PIM Top Silkscreen and Top Copper
Figure 2-4. dsPIC33AK512MPS506 Digital Power PIM MID1 and MID2 Inner Copper (Bottom View)
Figure 2-5. dsPIC33AK512MPS506 Digital Power PIM Bottom Silkscreen and Bottom Copper (Bottom View)
Figure 2-6. dsPIC33AK512MPS506 Digital Power PIM Top and Bottom Assembly