The dsPIC33AK512MPS506 DP PIM is a four-layer FR4, 1.55 mm, Plated-Through-Hole (PTH) PCB
construction. Figure 2-3 through Figure 2-5 illustrate the PCB layers and Figure 2-6 shows the assembly
drawings of the dsPIC33AK512MPS506 DP PIM.
Figure 2-3. dsPIC33AK512MPS506 Digital Power
PIM Top Silkscreen and Top CopperFigure 2-4. dsPIC33AK512MPS506 Digital Power
PIM MID1 and MID2 Inner Copper (Bottom View)Figure 2-5. dsPIC33AK512MPS506 Digital Power
PIM Bottom Silkscreen and Bottom Copper (Bottom View)Figure 2-6. dsPIC33AK512MPS506 Digital Power
PIM Top and Bottom Assembly
The online versions of the documents are provided as a courtesy. Verify all content and data in the device’s PDF documentation found on the device product page.