9 Revision History

Revision C (August 2024)

Updated DC Characteristics table. Minor editorial updates throughout the document.

Revision B (July 2021)

Added note to table 4-6 that explains the array architecture and how endurance is specified. Replaced terminology "Master" and "Slave" with "Host" and "Client" respectively. Removed XDFN package option. Updated SOIC, TSSOP and UDFN package drawings.

Revision A (June 2018)

Updated to the Microchip template. Microchip DS20005993A replaces Atmel document 8535. Updated Part Marking Information. Added ESD rating. Removed lead finish designation. Added POR recommendations section. Updated trace code format in package markings. Updated section content throughout for clarification. Updated the SOIC, TSSOP, and UDFN package drawings to the Microchip equivalents.

Atmel Document 8535 Revision H (January 2015)

Added the UDFN Expanded Quantity Option. Updated the 8X, 8MA2, and 8ME1 package outline drawings and the ordering information.

Atmel Document 8535 Revision G (November 2012)

Updated part markings to single page part marking. Updated package drawings. Replaced 8A2 package with 8X package. Update template and Atmel logos.

Atmel Document 8535 Revision F (June 2010)

Updated 8A2 and 8S1 package drawings. Remove Preliminary.

Atmel Document 8535 Revision E (April 2010)

Updated Ordering Code Detail, Ordering Information, template.

Atmel Document 8535 Revision D (August 2009)

Changed Catalog Numbering. Added new Part Marking Information.

Atmel Document 8535 Revision C (May 2009)

Added Part Marking information; changed to Preliminary status.

Atmel Document 8535 Revision B (July 2008)

Modified ‘Endurance’ parameter on page 6.

Atmel Document 8535 Revision A (April 2008)

Initial document release.