50.9 Thermal Characteristics

Table 50-6. 
Standard Operating Conditions (unless otherwise stated)
Param No. Sym. Characteristic Typ. Units Conditions
TH01 θJA Thermal Resistance Junction to Ambient 57.1 °C/W 28-pin SPDIP package
46.0 °C/W 28-pin SOIC package
54.5 °C/W 28-pin SSOP package
36.5 °C/W 28-pin VQFN package
TH02 TJMAX Maximum Junction Temperature 150 °C
Note:
  1. See “Absolute Maximum Ratings” for total power dissipation.