2.1 Thermal Characteristics

In Table 39-6 Thermal Characteristics of the Electrical Specifications chapter, the Thermal Resistance Junction to Ambient (θ_JA) and Thermal Resistance Junction to Case (θ_JC) are not specified for the 28-pin VQFN (4x4 mm) package type. The table below has been amended to include the missing specifications, and the corresponding parameters (TH01 and TH02) will be updated in the next revision of the datasheet.

Table 2-1.
Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +125°C
Param No.	Sym.	Characteristic	Typ.	Units	Conditions
TH01	θ_JA	Thermal Resistance Junction to Ambient	55	°C/W	28-pin SPDIP package
			74	°C/W	28-pin SOIC package
			67.1	°C/W	28-pin SSOP package
			36.2	°C/W	28-pin VQFN 4x4 mm package
TH02	θ_JC	Thermal Resistance Junction to Case	36	°C/W	28-pin SPDIP package
			19	°C/W	28-pin SOIC package
			23.9	°C/W	28-pin SSOP package
			41.9	°C/W	28-pin VQFN 4x4 mm package
TH03	T_JMAX	Maximum Junction Temperature	—	°C	T_JMAX = T_AMAX + (PD_MAX x θ_JA)⁽²⁾
TH04	PD	Power Dissipation	—	W	PD = P_INTERNAL+P_I/O
TH05	P_INTERNAL	Internal Power Dissipation	—	W	P_INTERNAL = I_DDxV_DD⁽¹⁾
TH06	P_I/O	I/O Power Dissipation	—	W	P_I/O=Σ(I_OLV_OL)+Σ(I_OH(V_DD-V_OH))
TH07	P_DER	Derated Power	—	W	P_DER = PD_MAX (T_J-T_A)/θ_JA⁽²⁾
Note: I_DD is current to run the chip alone without driving any load on the output pins. T_A = Ambient Temperature, T_J = Junction Temperature.