39.6.1 Thermal Resistance Data
The following table summarizes the thermal resistance data depending on the package.
| Pin Count | Package Type | θJA [°C/W] | θJC [°C/W] |
|---|---|---|---|
| 14 | SOIC | 58 | 26 |
| 20 | SOIC | 44 | 21 |
| 20 | VQFN | 79.7 | 36 |
| 24 | VQFN | 60.6 | 25 |
The following table summarizes the thermal resistance data depending on the package.
| Pin Count | Package Type | θJA [°C/W] | θJC [°C/W] |
|---|---|---|---|
| 14 | SOIC | 58 | 26 |
| 20 | SOIC | 44 | 21 |
| 20 | VQFN | 79.7 | 36 |
| 24 | VQFN | 60.6 | 25 |
The online versions of the documents are provided as a courtesy. Verify all content and data in the device’s PDF documentation found on the device product page.