4.4 Signal Integrity

The following guidelines are recommended for high speed transceiver trace routing.

1. Match length between P and N within 1 mil.
2. Maintain the impedance between 85 to 100 ohms.
3. Model the via, BGA pad, and connector discontinuities to match the trace impedance.
4. Use loosely coupled differential traces.
5. Use low loss PCB materials.
6. Use low roughness copper PCB material.

For more information about the routing of high-speed signals, see section 4.2 of UG0726: PolarFire FPGA Board Design User Guide.