Use the multi-layer host board for routing signals on the inner layer and the bottom layer.
The top layer (underneath the module) of the host
board must be ground with as many GND vias as possible (see the following
figure).
Avoid fan-out of the signals under the module or
antenna area. Use a via to fan-out signals to the edge of the RNBD451 module.
For a better GND connection to the RNBD451 module, solder the exposed GND pads of the RNBD451 module on the host board.
For the module GND pad, use a GND via of a minimum 10 mil (hole diameter) for good ground to all the layers and thermal conduction path.
Having a series resistor on the host board for
all GPIOs is recommended. Place these resistors close to the RNBD451 module. The following figure
illustrates the placement of the series resistor.Figure 6-2. Example of Host Board on
Top Layer
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