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RNBD451 Bluetooth® Low Energy Module Data Sheet
Introduction
Features
Operational Conditions
RF/Analog Features
Applications
1 Quick References
1.1 Reference Documentation
1.2 Acronyms and Abbreviations
2 Ordering Information
2.1 RNBD451 Module Ordering Information
3 Device Overview
3.1 Module Overview
3.2 Module Configuration
3.3 Device Power Modes
3.4 Device Programming
4 Electrical Characteristics
4.1 Absolute Maximum Electrical Characteristics
4.2 DC Electrical Characteristics
4.3 Active Current Consumption DC Electrical Specifications
4.4 Sleep Current Consumption DC Electrical Specifications
4.5 Deep Sleep Current Consumption DC Electrical Specifications
4.6 XDS (Extreme Deep Sleep) Current Consumption DC Electrical Specifications
4.7 Power Supply DC Module Electrical Specifications
4.8 I/O PIN AC/DC Electrical Specifications
4.9 ADC Electrical Specifications
4.10 Bluetooth Low Energy RF Characteristics
5 Basic Connection Requirement
5.1 Power Pins
5.2 Master Clear (NMCLR) Pin
5.3 Unused I/O Pins
5.4 Interface Pins
6 Physical Dimensions and Attributes
6.1 RNBD451 Module Placement Guidelines
6.2 RNBD451 Module Routing Guidelines
6.3 RNBD451 Module Packaging Information
6.4 RNBD451 Module RF Considerations
6.5 RNBD451 Module Antenna Considerations
6.6 RNBD451 Module Reflow Profile Information
6.7 RNBD451 Module Assembly Considerations
7 ASCII Command API
8 Application Reference Schematics
9 Supported Bluetooth Low Energy Profile and Services
10 Appendix A: Regulatory Approval
10.1 United States
10.2 Canada
10.3 Europe
10.4 Japan
10.5 Korea
10.6 Taiwan
10.7 China
10.8 UKCA (UK Conformity Assessed)
10.9 Other Regulatory Information
11 Document Revision History
Microchip Information
The Microchip Website
Product Change Notification Service
Customer Support
Microchip Devices Code Protection Feature
Legal Notice
Trademarks
Quality Management System
Worldwide Sales and Service

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