3.6 Electrical Characteristics - Memory Programming Specifications

A clarification has been made to change the Flash memory cell endurance specification in the Memory Programming Specifications table.

Table 37-8. Memory Programming Specifications

SymbolDescriptionMin.Typ.✝Max.UnitConditions
Data EEPROM Memory Specifications
ED*Data EEPROM byte endurance100kErase/Write cycles-40°C ≤ TA ≤ +85°C
tD_RETCharacteristic retention40YearProvided no other violated specifications
VD_RWVDD for Read or Erase/Write operationVDDMINVDDMAXV
ND_REF*Total Erase/Write cycles before refresh1M4MErase/Write cycles-40°C ≤ TA ≤ +85°C
tD_CEByte/Multibyte/Full EEPROM Erase time1010.5ms
tD_WREByte Write time7075μs
tD_BEWByte Erase and Write time10.07ms
Program Flash Memory Specifications
EP*Flash memory cell endurance1kErase/Write cycles
tP_RETCharacteristic retention40Year
VP_RDVDD for Read operationVDDMINVDDMAXV
VP_REWVDD for Erase/Write operationVDD(1)VDDMAXV
tP_CEChip Erase time1111.6ms
tP_PEPage Erase time1010.5ms
tP_WRDByte/Word Write time7075μs

Data in the “Typ.” column is at TA = 25°C and VDD = 3.0V unless otherwise specified. These parameters are for design guidance only and are not tested.

* These parameters are characterized but not tested in production.

Note:
  1. During Chip Erase, the Brown-out Detector (BOD) configured with BODLEVEL0 is forced ON. The erase attempt will fail if the supply voltage VDD is below VBOD for BODLEVEL0.