7 Revision History

Revision B (February 2024)

Removed 8-pad XDFN product offering. Replaced "Master" terminology with "Host".

Revision A (October 2019)

Updated to the Microchip template. Microchip DS20006260 replaces Atmel document 8735. Updated Package Marking Information. Removed lead finish designation. Updated trace code format in package markings. Updated section content throughout for clarification. Updated 8U3-1 VFBGA package drawing. Updated the SOIC, TSSOP, UDFN package drawings to Microchip format

Atmel 8735 Revision C (January 2015)

Added the UDFN extended quantity option and update package outline drawings. Update the 8MA2 package drawing.

Atmel 8735 Revision B (April 2013)

Corrected Synchronous Data Timing figure and removed note. Updated TSSOP package option from 8A2 to 8X. Updated UDFN package option from 8Y6 to 8MA2. Updated template and Atmel logos.

Atmel 8735 Revision A (January 2011)

Initial document release.