11 Revision History
Revision B (June 2025)
: No changes have been made to the actual
silicon. Changes are only to the data sheet.
- Introduction: WPC updates to indicate support for Qi 2.x and Ki 1.x.
- Features:
- Added NIST certified to TRNG bullet.
- Updated WPC bullet indicating support for Q2.x and Ki 1.x standards.
- Use Cases: Added Ki use cases.
- Wireless Power Consortium: Updated for Qi 2.x and Ki 1.x.
- Wireless Power Consortium Terminology: Added Ki term.
- Random Number Generator (RNG): Added specification information. Added ESV information.
- DC Parameters: All I/O Interfaces:
- Added input thresholds when in Sleep mode (VILS, VIHS).
- Updated Theta JA values.
GenKey
Command: Removed MAC calculation from TFLX data sheet versions.Nonce
Command: Removed session key information.- Use Cases: Updated use case information to cover Qi and Ki.
- WPC Engagement: Updated to cover Qi and Ki.
- Hardware Tools: Added/updated tool descriptions.
- Product Identification System: Product Identification now separate section and not part of Back Matter.
- Microchip Information: Back Matter simplified per Microchip’s new standard.
Revision A (March 2023)
- Initial data sheet release.