44.1 Absolute Maximum Ratings(†)
Parameter | Rating | ||
---|---|---|---|
Ambient temperature under bias | -40°C to +125°C | ||
Storage temperature | -65°C to +150°C | ||
Voltage on pins with respect to VSS | |||
|
-0.3V to +6.5V | ||
|
-0.3V to +9.0V | ||
|
-0.3V to (VDD + 0.3V) | ||
Maximum current(1) | |||
|
-40°C ≤ TA ≤ +85°C | 300 mA | |
85°C < TA ≤ +125°C | 120 mA | ||
|
-40°C ≤ TA ≤ +85°C | 250 mA | |
85°C < TA ≤ +125°C | 85 mA | ||
|
±25 mA | ||
Clamp current, IK (VPIN < 0 or VPIN > VDD) | ±20 mA | ||
Total power dissipation(2) | 800 mW |
Note:
- Maximum current rating requires even load distribution across I/O pins. Maximum current rating may be limited by the device package power dissipation characterizations, see Thermal Characteristics to calculate device specifications.
- Power dissipation is calculated as
follows:
PDIS = VDD x {IDD - Σ IOH} + Σ {(VDD - VOH) x IOH} + Σ (VOI x IOL)
- Internal Power Dissipation is
calculated as follows:
PINTERNAL = IDD x VDD
- I/O Power Dissipation is calculated
as follows:
PI/O = Σ(IOL*VOL)+Σ(IOH*(VDD-VOH))
- Derated Power is calculated as
follows:
PDER = PDMAX(TJ-TA)/θJA
Notice: Stresses above those listed under the Absolute Maximum Ratings
section may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at those or any other conditions above those indicated
in the operation listings of this specification is not implied. Exposure above maximum
rating conditions for extended periods may affect device reliability.