44.1.2 64-Pin VQFN

Note: The exposed die attach pad is not connected electrically inside the device. It is recommenced to attach (solder) the exposed pad to a matching perimeter landing beneath the package punctuated with vias to the ground layer.
Table 44-3. Device and Package Maximum Weight
200mg
Table 44-4. Package Reference
Package Outline Drawing MCHP referenceC04-21441
JESD97 ClassificationE3