44.1.7 48-Pin VQFN

Note: The exposed die attach pad is not connected electrically inside the device. It is recommenced to attach (solder) the exposed pad to a matching perimeter landing beneath the package punctuated with vias to the ground layer.
Table 44-13. Device and Package Maximum Weight
140mg
Table 44-14. Package Reference
Package Outline Drawing MCHP referenceC04-21425
JESD97 ClassificationE3