35.2.10 32-Pin VQFN for Industrial Variants
Note: The exposed die attach pad is connected
inside the device to GND and GNDANA.
| 90 | mg |
| Package Outline Drawing MCHP reference | C04-21402 |
| JESD97 Classification | E3 |
| 90 | mg |
| Package Outline Drawing MCHP reference | C04-21402 |
| JESD97 Classification | E3 |
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