The following table summarizes the thermal resistance data for non-AEC-Q100
packages..
Table 35-1. Thermal
Resistance Data for non-AEC-Q100 packages
| Package Type |
θJA |
θJC |
| 32-pin TQFP |
68.0°C/W |
25.8°C/W |
| 48-pin TQFP |
78.8°C/W |
12.3°C/W |
| 64-pin TQFP |
66.7°C/W |
11.9°C/W |
| 32-pin VQFN |
37.2°C/W |
13.1°C/W |
| 48-pin VQFN |
33.0°C/W |
11.4°C/W |
| 64-pin VQFN |
33.5°C/W |
11.2°C/W |
| 64-ball UFBGA |
67.4°C/W |
12.4°C/W |
| 45-ball WLCSP |
37.0°C/W |
0.36°C/W |
| 27-ball WLCSP |
84.54°C/W |
16.86°C/W |
The following table summarizes the thermal resistance data for AEC-Q100 packages.
Table 35-2. Thermal Resistance Data for
AEC-Q100 packages
| Package Type |
θJA |
θJC |
| 64-pin TQFP |
53.7 |
15.4 |
| 48-pin TQFP |
58.6 |
16.1 |
| 32-pin TQFP |
58.2 |
18.8 |
| 64-pin VQFN |
28.4 |
12 |
| 48-pin VQFN |
27.6 |
12.7 |
| 32-pin VQFN |
29.8 |
15.9 |
