2.3 Chip-Down Design Package

The Chip-Down Design Package is a guide for customers wanting to do their own chip-level RF PCB designs. In addition, it contains software tools for manufacturing and regulatory testing. The package includes the following:

AN2842 RF Hardware Design Guidelines
Complete CAD source for SAMR34-XPRO
MCHPRT PC Application for Production and Regulatory Testing
Example Python^® scripts
SAMR34 Radio Utility Firmware

The online versions of the documents are provided as a courtesy. Verify all content and data in the device’s PDF documentation found on the device product page.