5.1 Power and Thermal Measurements

The board used for the measurements is an evaluation board with the same characteristics and size as the SAMA7G54 Evaluation Kit.

Figure 5-1 and Figure 5-2 report results from a selected part having maximum power consumption characteristics.

Figure 5-1 shows a 300 mW power difference between Case 1 and Case 2.

Figure 5-2 shows a 5°C temperature difference between Case 1 and Case 2.

Figure 5-3 is a thermal image of the SiP (with CPU 100% loaded and ambient temperature at 21°C) showing the CPU hot spot. The DDR is located in a cold area of the SiP. The embedded temperature sensor is close to the CPU, and so measures the worst case temperature of the SiP.