10 Soldering Recommendations

The BM83 module can be soldered to the host board using standard leaded and lead-free solder reflow profiles. The BM83 module is assembled using a standard lead-free reflow profile, IPC/JEDEC J-STD-020.

To avoid the damage to the module, it is mandatory to follow the recommendations as listed:

  • Refer to AN233 Solder Reflow Recommendation Application Note for the soldering reflow recommendations.
  • Do not exceed peak temperature (TP) of +260ºC.
  • Use no-clean flux solder paste.
  • Do not wash the module as moisture can be trapped under the shield.
  • Use only one flow. If the PCB requires multiple flows, apply the module on the final flow.

The following figure illustrates the reflow profile of the BM83 module.

Figure 10-1. Reflow Profile