38.4.6 Thermal Characteristics
Symbol | Description | Typ. | Units | Conditions |
---|---|---|---|---|
θJA | Thermal Resistance Junction to Ambient (Thermal simulation, no airflow) | 63.37 | °C/W | 14-pin SOIC package (SL) |
53.02 | °C/W | 20-pin SOIC package (SO) | ||
54.89 | °C/W | 20-pin VQFN package (REB) | ||
Note:
|