Added 1.8V operation back to the
feature list for both Industrial and Commercial Temperature ranges.
Modified wording in Package
Marking Disclaimer to indicate TPM security devices instead of
CryptoAuthentication Devices.
Updated Portion of ordering code
to G6 and H6 from G3 and H3 to reflect newest silicon revision. 1.8V supply
range is now supported for industrial grade products. G3/H3 silicon is no longer
available for sale.
Updated Revision information in TCG PC Client Platform TPM Profile (PTP)
Specification Summary section.
Updated SPI Terminology.
Updated UDFN Package Outline
Drawings to latest version.
Revision B (September
2019)
Removed 1.8V operation from the
Features list.
Revision A (December 2018)
Original release of this document. Generated from the full version of the
Trusted Platform Module (TPM) 2.0 - SPI Interface data sheet. Microchip Doc#:
DS40002064.
The online versions of the documents are provided as a courtesy. Verify all content and data in the device’s PDF documentation found on the device product page.
