43 Revision History

Revision B - 04/2025

The following updates were performed for this revision:

SectionUpdates
Pinout and Packaging
  • Updated the following Pinout sections to reflect new CMP values for the AC column:
    • 32-pin VQFN/32-pin TQFP Pinout and Multiplexing
    • 48-pin VQFN/48-pin TQFP Pinout and Multiplexing
    • 64-pin VQFN/64-pin TQFP Pinout and Multiplexing
  • Added a new section, Other Functions
Electrical Specifications 85°C
  • Updated the Maximum Junction Temperature in Absolute Maximum Ratings
  • Replaced the equations for Power Dissipation in General Operating Ratings and Thermal Conditions
  • Updated the notes, VBODVDD signals, and/or removed erroneous content in the following sections:
    • Power Supply
    • Idle Power
    • MCU Standby Power
    • I/O Specifications
    • XOSC Electrical Specifications
    • XOSC32K Electrical Specifications
    • FDPLL96M Electrical Specifications
    • Serial Peripheral Interface (SPI) Mode Electrical Specifications
Electrical Specifications 125°C
  • Replaced the equations for Power Dissipation in General Operating Ratings and Thermal Conditions
  • Updated the notes, VBODVDD signals, and/or removed erroneous content in the following sections:
    • Power Supply
    • Idle Power
    • NVM Block (Flash, Data Flash, NVM Configuration Rows) Electrical Specifications
  • Added new sections:
    • I/O Electrical Specifications
    • Serial Peripheral Interface (SPI) Mode Electrical Specifications

Revision A - 02/2025

This is the initial release of the document.