59.1 228-ball TFBGA Mechanical Characteristics

Table 59-1. 228-ball TFBGA Package Characteristics
Moisture Sensitivity Level3
Table 59-2. Device and 228-ball TFBGA Package Weight
247mg
Table 59-3. Package Reference
JEDEC Drawing ReferenceNA
J-STD-609 Classificatione8
Table 59-4. 228-ball TFBGA Package Information
Ball Land0.40 mm
Nominal Ball Diameter0.35 mm
Solder Mask Opening0.30 mm
Solder Mask DefinitionNSMD
SolderSAC105