59.1 228-ball TFBGA Mechanical Characteristics

Table 59-1. 228-ball TFBGA Package Characteristics
Moisture Sensitivity Level	3

Table 59-2. Device and 228-ball TFBGA Package Weight
247	mg

Table 59-3. Package Reference
JEDEC Drawing Reference	NA
J-STD-609 Classification	e8

Table 59-4. 228-ball TFBGA Package Information
Ball Land	0.40 mm
Nominal Ball Diameter	0.35 mm
Solder Mask Opening	0.30 mm
Solder Mask Definition	NSMD
Solder	SAC105

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