58.3 Recommended Operating Conditions

Table 58-3. Recommended Operating Conditions on Power Supply Inputs
Power InputParameterConditionsMinMaxUnit
VDDCORECore logic power supply (including CPU, memories and peripherals)fCPU ≤ 420 MHz, fMCK ≤ 140 MHz

fCPU ≤ 600 MHz, fMCK ≤ 200 MHz

1.02

1.12

1.21

1.21

V
VDDIOMSDRAM I/O lines power supplySDR-SDRAM3.003.60V
LPDDR-SDRAM, LPSDR-SDRAM, DDR2-SDRAM1.701.90V
VDDNFNAND Flash I/O lines power supply1.703.60V
VDDQSPIVDDQSPI I/O lines power supply1.703.60V
VDDANA(1)VDDANA I/O lines, A/D converter, OTP memory power supply3.003.60V
VDDIN33(1)2.5V regulator power input, USB interface I/O lines power supply3.003.60V
VDDIOP0VDDIOP0 I/O lines power supply1.703.60V
VDDIOP1VDDIOP1 I/O lines power supply1.703.60V
VDDBUBackup domain power supply1.603.60V
tR_VDDPower supply slope at power-upApplies to any of the power supply inputs listed above0.220mV/µs
tF_VDDPower supply slope at power-downApplies to any of the power supply inputs listed above-20-1mV/µs
Note:
  1. VDDANA and VDDIN33 are powered from one single power source so that:

    V(VDDANA,VDDIN33) ≤ ±50mV.

Table 58-4. Recommended Operating Conditions on Input Pins (see Note 1)
SymbolParameterConditionsMinMaxUnit
VINInput line voltage range on inputs(2)(3)-0.3VVDD + 0.3VV
IINDC current injection on inputs(4)±0.2 mA
ITOT_INJTotal current injection per power rail or per ground rail(5)±2 mA
Note:
  1. In this table, VDD refers to the voltage of the associated power rail of the I/O line, as defined in the Pin Description table. For example, for PA2, VDD refers to VDDIOP0.
  2. Input voltages VIN ≤ 0V or VIN ≥ VDD lead to negative or positive current injection on inputs.
  3. For analog inputs [PB17:PB6], input voltages VIN ≥ min(VDDANA, VADVREFP) lead to saturated A/D conversion to 0xFFF.
  4. Current injection on A/D converter analog inputs [PB17:PB6] may degrade the analog performance of the corresponding channel or the analog performance of other analog channels.
  5. Corresponds to the sum of the positive currents into one power rail and respectively to the sum of the negative currents into one ground rail as defined in the Pin Description table.

Table 58-5. Recommended Thermal Operating Conditions
SymbolParameterConditionsMinMaxUnit
TAAmbient temperature range-40105°C
TJJunction temperature range-40125°C
RJAJunction-to-ambient thermal resistanceBGA22840°C/W
PDAllowable power dissipationBGA228TA = 70°C1.3W
TA = 85°C1.0W
TA = 105°C0.5W

Table 58-6. Recommended Operating Conditions on Internal Clocks
SymbolParameterConditionsMinMaxUnit
fCPU_CLKProcessor clock (CPU_CLK) frequencyVDDCORE ≥ 1.12V600MHz
VDDCORE ≥ 1.02V420MHz
fMCKMain system bus clock (MCK) frequencyVDDCORE ≥ 1.12V200MHz
VDDCORE ≥ 1.02V140MHz

Table 58-7. Recommended Operating Conditions on SDRAM Interface
SymbolParameterConditionsMinMaxUnit
fSDRAM_CLKSDRAM clock frequencyVDDCORE ≥ 1.12V
16-bit SDR-SDRAM200MHz
16-bit LPSDR-SDRAM166MHz
16-bit DDR2-SDRAM125200MHz
16-bit LPDDR-SDRAM200MHz
VDDCORE ≥ 1.12V
32-bit SDR-SDRAM180MHz
32-bit LPSDR-SDRAM158MHz
VDDCORE ≥ 1.02V
16-bit SDR-SDRAM140MHz
16-bit LPSDR-SDRAM140MHz
16-bit DDR2-SDRAM125140MHz
16-bit LPDDR-SDRAM140MHz