67.3 289-Ball Thin Fine-Pitch Ball Grid Array Package (8GW) - 9x9x1.2 mm Body [TFBGA]

Table 67-9. 289-ball TFBGA Package Characteristics
Moisture Sensitivity Level3
Table 67-10. Device and 289-ball TFBGA Package Weight
200mg
Table 67-11. Package Reference
JEDEC Drawing ReferenceNA
J-STD-609 Classificatione8
Table 67-12. 289-ball TFBGA Package Information
Ball Land0.400 mm
Nominal Ball Diameter0.320 mm
Solder Mask Opening0.275 mm
Solder Mask DefinitionSMD
SolderLF35