47.3.6 Thermal Characteristics

Table 47-6. Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Param No. Sym. Characteristic Typ. Units Conditions
TH01 θJA Thermal Resistance Junction to Ambient 60 °C/W 28-pin SPDIP package
80 °C/W 28-pin SOIC package
90 °C/W 28-pin SSOP package
27.5 °C/W 28-pin VQFN 4x4 mm package
47.2 °C/W 40-pin PDIP package
29 °C/W 40-pin QFN package
46 °C/W 44-pin TQFP package
62.8 °C/W 48-pin TQFP package
24.8 °C/W 48-pin VQFN package
TH02 TJMAX Maximum Junction Temperature 150 °C
Note:
  1. See “Absolute Maximum Ratings” for total power dissipation.