47.4.2 Internal Oscillator Parameters⁽¹⁾

Table 47-8.
Standard Operating Conditions (unless otherwise stated)
Param No.	Sym.	Characteristic	Min.	Typ. †	Max.	Units	Conditions
OS50	F_HFOSC	Precision Calibrated HFINTOSC Frequency	—	4 8 12 16 32 48 64	—	MHz	(Note 2)
OS51	F_HFOSCLP	Low-Power Optimized HFINTOSC Frequency	0.92 1.84 0.88 1.76	1 2 1 2	1.08 2.16 1.12 2.24	MHz MHz MHz MHz	-40°C ≤ T_A ≤ 85°C -40°C ≤ T_A ≤ 85°C 85°C ≤ T_A ≤ 125°C 85°C ≤ T_A ≤ 125°C
OS52	F_MFOSC	Internal Calibrated MFINTOSC Frequency	—	500	—	kHz
OS53	F_LFOSC	Internal LFINTOSC Frequency	24.8	31	37.2	kHz
OS54	T_HFOSCST	HFINTOSC Wake-up from Sleep Start-up Time	—	13	20	μs	VREGPM = `00` System Clock at 4 MHz V_DD = 3.0V
			—	30	48	μs	VREGPM = `01` System Clock at 4 MHz V_DD = 3.0V
			—	115	210	μs	VREGPM = `10` System Clock at 4 MHz V_DD = 3.0V
			—	120	220	μs	VREGPM = `11` System Clock at 4 MHz V_DD = 3.0V
OS56	T_LFOSCST	LFINTOSC Wake-up from Sleep Start-up Time	—	292	420	μs	25ºC ≤ T_A ≤ 125ºC V_DD = 3.0V VREGPM = `xx`
* These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note: To ensure these oscillator frequency tolerances, V_DD and V_SS must be capacitively decoupled as close to the device as possible. 0.1 μF and 0.01 μF values in parallel are recommended. See the figure below.

47.4.2 Internal Oscillator Parameters(1)