1.2 SAMG55 XPLAINED PRO + PL460-EK + ATREB215-XPRO-A
This supported platform is composed of three different evaluation boards:
- The first board, a SAMG55 XPLAINED PRO evaluation kit, includes the host controller, a SAMG55J19, to run the application and the upper layers of the stack
- The second board is the PL460-EK as the PLC module with a PL460 to run the PHY and MAC-RT layers for the PLC communications.
- The third board is an ATREB215-XPRO-A with the AT86RF215 to run the PHY layer for the RF module. The RF module is configured to run on the sub-GHz band.
The SAMG55 XPLAINED PRO board uses the DEBUG USB connector to communicate with a PC via console.
The SAMG55 XPLAINED PRO board uses EXT3 to communicate with the ATREB215-XPRO-A board. The lines used in the connection between both boards are described in the following table:
| Description | Xpained PRO Header (ATREB215-XPRO-A) |
|---|---|
| 3V3 Power | 20 (3V3) |
| GND | 2 (GND) |
| 19 (GND) | |
| SPI | 15 (SPI_SS_A) |
| 18 (SPI_SCK) | |
| 17 (SPI_MISO) | |
| 16 ( SPI_MOSI) | |
| RF215 Reset | 7 (PWM+) |
| RF215 Interruption | 9 (IRQ/GPIO) |
| LED1 | 6 (GPIO2) |
| LED2 | 5 (GPIO1) |
The SAMG55 XPLAINED PRO board uses EXT1 (with the Xplained Pro Power Header) to communicate with the PL460-EK. The lines used in the connection between both boards are described in the following table:
| Description | Xpained PRO Header (PL460-EK) |
|---|---|
| 3V3 Power | 20 (3V3) |
| GND | 2 (GND) |
| 19 (GND) | |
| SPI | 15 (SPI_SS_A) |
| 18 (SPI_SCK) | |
| 17 (SPI_MISO) | |
| 16 ( SPI_MOSI) | |
| PL460 Reset | 7 (PWM+) |
| PL460 Enable | 8 (PWM-) |
| PL460 Interruption | 9 (IRQ/GPIO) |
| PL460 NTHW0 Thermal warning | 10 (GPIO) |
| PL460 Standby | 11 (SDA) |
| PL460 Carrier detect | 12 (SCL) |
The SAMG55 XPLAINED PRO board is powered by the USB connector, which also powers the ATREB215-XPRO-A board. The PL460-EK must be powered independently with its own 15V power supply.