10 Revision History
Revision C (February 2024)
Corrected embedded addressing bit location in byte write, page write and read waveforms. Deleted TSSOP Grade 3 offerings. Replaced terminology “Master” and “Slave” with “Host” and “Client”, respectively.
Revision B (May 2020)
Corrected operating ranges for Table 4-3. Updated UDFN package drawing.
Revision A (December 2019)
Updated to Microchip template. Microchip DS20006285 replaces Atmel document 8802. Updated Part Marking Information. Added ESD rating. Added missing IIL Max. parameter. Removed lead finish designation. Removed the Automotive Grade 2 option. Updated POR recommendations section. Updated trace code format in package markings. Updated formatting throughout for clarification. Updated the SOIC, TSSOP and UDFN package drawings to the Microchip equivalents.
Atmel Document 8802 Revision E (December 2016)
Decreased ISB1 maximum from 9 μA to 2 μA
Atmel Document 8802 Revision D (September 2016)
Added the Automotive Grade 2 and 3 options and UDFN options. Updated 8S1 and 8X package drawings, template/reorganization, and disclaimer page.
Atmel Document 8802 Revision C (November 2012)
Updated ordering code tables. Updated 8X package drawing.
Atmel Document 8802 Revision B (October 2012)
Removed preliminary status. Updated Atmel logos and disclaimer/copy page.
Atmel Document 8802 Revision A (March 2012)
Initial document release.