ATWINC15x0

10.1 Module Footprint

This section provides the outline drawing for the recommended footprint for the ATWINC15x0-MR210xB module. It is imperative that the center Ground Pad is provided, with an array of vias to provide for a good ground and thermal transfer for the ATWINC15x0-MR210xB module.

This footprint is applicable to the ATWINC15x0-MR210xB module devices.

Figure 10-3. Module Solder Pad Footprint (unit = mm).

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