11 Revision History

Revision B (January 2025)

Removed TSSOP Grade 3 offering. Updated DC Characteristics table to remove "Typical" column. Updated package drawings to current version. Replaced terminology “Master” and “Slave” with “Host” and “Client”, respectively.

Revision A (January 2019)

Updated to the Microchip template. Microchip DS20006141 replaces Atmel document 8819. Removed non-applicable Output High-Voltage DC parameter. Updated Part Marking Information. Updated the "Software Reset" section. Added ESD rating. Removed lead finish designation. Updated trace code format in package markings. Added a figure for “System Configuration Using Two‑Wire Serial EEPROMs”. Updated "Block Diagram" figure. Updated section content throughout for clarification. Removed the Automotive Grade 2 option. Added the SOT23 package option and package drawing. Updated the SOIC, TSSOP and UDFN package drawings to Microchip format.

Atmel Document 8819 Revision C (September 2016)

Added the Automotive Grade 2 and 3, UDFN options, ordering code detail and table of contents. Updated the “Software Reset” section, part marking, and the 8S1 package drawing.

Atmel Document 8819 Revision B (August 2014)

Increased t_AA maximum from 90 ns to 900 ns. Updated the 8X package drawing, footers, and the disclaimer page.

Atmel Document 8819 Revision A (December 2012)

Initial document release.