3.1.2 Thermal Specifications

Table 3-2. Thermal Operating Conditions
RatingSymbolMin.TypMax.Unit
Industrial Temperature Devices:
Operating ambient temperature rangeTA-40—+85°C
Operating junction temperature rangeTJ-40—+125°C
Various Temperature Devices:
Operating ambient temperature rangeTA-40—+105°C
Operating junction temperature range(1)TJ-40—+125°C
Power Dissipation:

Internal chip power dissipation:

PINT = (VDDIOx x (IDD –∑ IOH)) + (VDD x IDD)

PDPINT + PI/OW
Maximum allowed power dissipationPDMAX(TJ – TA)/ϴJAW
Note:
  1. Junction temperature can exceed 125°C under these ambient conditions.
Table 3-3. Thermal Packaging Characteristics
CharacteristicsSymbolTypMax.Unit

Thermal resistance, 48-pin VQFN (7 mm x 7 mm x 0.9 mm) package

ϴJA21—°C/W
Note: Junction-to-ambient thermal resistance, ϴJA numbers are based on JEDEC 2S2P achieved by package simulations.
Table 3-4. Recommended Operating Voltages
Param. No.SymbolCharacteristicsMin.Typ. Max.UnitConditions
DC_1VDDVDD voltage range33.33.6V —
DC_4VDDIOVDDIO voltage range33.33.6V—
DC_7GND Common EDP ground referenceVSSVSSVSSV —