Unless otherwise noted, these values
are valid over the junction temperature range defined in Ordering Information. This
junction temperature range is referred to as the “applicable TJ range" in
the following sections.
Parameters annotated as "Simulation
data" are not production-tested. Their limiting values come from simulations run in
corner case conditions and were verified by electrical characterization over a
limited number of samples. Additionally, the specifications in Digital Peripheral
Timings are simulation data, even though they are not annotated as
such.
These limits may be affected by the
board on which the device is mounted. In particular, noisy supply and ground
conditions must be avoided and care must be taken to provide:
a PCB with a low-impedance
ground plane. A single unbroken ground plane is a minimum requirement.
low-impedance decoupling of the
device power supply inputs. A 10 nF to 220 nF Ceramic X7R (or X5R) capacitor
placed very close to each power supply input is a minimum requirement. See
specific recommendations regarding analog pins or functions in the
corresponding sections. To reduce any potential electromagnetic compatibility
(EMC) related issues, it is good practice to double this decoupling capacitor
whenever possible with a high frequency one, for example one 100 pF (C0G or
NP0) per power supply input.
low impedance power supply
decoupling of external components. This recommendation aims at avoiding large
current spikes flowing into the PCB ground and power planes.
In addition, although the device is
specified with wide operating supply ranges on most of its supply inputs (for example
1.7V to 3.6V), large and fast supply variations may lead to unpredictable device
behavior including, but not limited to, out-of-specification operation. Therefore, in
addition to maintaining the power supply inputs within their specified range, it is
also mandatory to keep the power supply variations within the limits described in
Table 11-1 during the device operation.
Finally, the device performances and
operating junction temperature are strongly dependent on the thermal performances of
the board on which the device is mounted. For further details, refer to the
application note "SAMA7G5 Series Power Consumption and Thermal Considerations"
(AN4797), available on www.microchip.com.
VDDANA and VDDDPHY are not mentioned
in this table, as they must be connected to the VDDOUT25 regulator output that
fulfills the electrical requirements of these power inputs.
VDC is the DC value of the power supply.
VDC_MIN
is the minimum operating voltage of the supply input as described in the Power Supply Inputs table.
ΔV is the amplitude of the variation. The slew rate specification applies when the
ΔV ≥ VN.
The following examples and figure illustrate this table:
When working with VDDIOP0 = 3.3V, a maximum power supply ripple and noise voltage of
99 mV peak-to-peak (3% of 3.3V) must be respected.
When working with VDDIN33 = 3.3V, a
maximum power supply ripple and noise voltage of 33 mV peak-to-peak (1% of 3.3V) must
be respected.
Figure 11-1. Maximum Power Supply Variation
The online versions of the documents are provided as a courtesy. Verify all content and data in the device’s PDF documentation found on the device product page.
