4.2 Common Temperature Soldering
The SnAgCu eutectic solder with melting temperature of 217°C is most commonly used for lead-free solder reflow applications.
This alloy is widely accepted in the semiconductor industry due to its low cost, relatively low melting temperature, and good thermal fatigue resistance.
Some recommended solder pastes are listed below (no clean solder paste):
- NC-SMQ® 230 from Indium Corp.
- Indalloy 241 from Indium Corp.
- N705-GRN3360-K2-V Type 3 from Senju
- M705-GRN360-K-V from Senju